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Outline (SO) - Wide, 5.3 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot190-1_po.pdf VSSOP-8 2.3x2mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm.

• 0.900365 0.42367 0.0992329 facet.
• 2.7mm, M2.5 mounting hole 3.2mm.
• Vertex -6.672863e+000 -2.335454e+000 1.747200e+001.
• 3.9 mm; lead pitch 0.65 mm.

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