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Mils 64-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 20-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 5-lead though-hole mounted DIP package, row spacing.

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