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12x12 raster, 10x10mm package, pitch 0.5mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zd.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 1x12, 2.00mm pitch, double rows Surface mounted pin header SMD 1x34 2.00mm single row Through hole socket strip SMD 2x08 1.27mm double row surface-mounted straight socket strip, 1x35, 2.00mm pitch, 6.35mm socket length, single row Surface mounted socket strip SMD 1x14 2.54mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header THT 2x02 1.00mm double row Through hole pin header SMD 1x23 2.00mm single row Surface mounted socket strip SMD 1x16 1.00mm.

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