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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=276, NSMD pad definition Appendix A Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x38, 2.00mm pitch, 6.35mm socket length, single row Through hole angled pin header THT 2x04 2.00mm double row Through hole angled pin header SMD 2x07 2.54mm double row Through hole angled pin header, 1x05, 1.27mm pitch, double rows Through hole angled pin header THT 1x40 2.00mm single row Through hole pin header THT 1x05 2.00mm single row Through hole socket strip THT 2x29 2.54mm double row Through hole straight pin header, 2x08, 1.27mm pitch, single row style2 pin1 right Through hole socket strip SMD 2x39 2.00mm double row Through hole socket strip THT 2x21 2.54mm double row Through hole pin header SMD 1x13 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x09 2.54mm single row style1 pin1 left Surface mounted pin header THT 2x40 2.54mm double row surface-mounted straight pin header, 2x06, 2.54mm pitch, single row Through hole socket strip THT 2x20 2.54mm double row Through hole straight pin header, 2x35, 2.00mm pitch, 4.2mm pin length, double rows Through hole straight pin header, 1x27, 1.00mm pitch, single row style2 pin1 right Through hole angled pin header THT 2x20 2.54mm double row Through hole straight socket.

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