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Files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back.

• MCV_1,5/10-GF-5.08; number of pins: 02; pin pitch: 3.50mm.
• Form, that is not required.
• 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch.
• 3114 terminal block RND 205-00308, 12.

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