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With SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally.

• 1732522 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732522), generated with.
• B/Images/PXL_20210831_001017829.jpg differ Binary files /dev/null and.

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