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2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l412t8.pdf ST WLCSP-49, off-center ball grid, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, RWH0032A, 8x8x0.9mm (http://www.ti.com/lit/ds/snosd10c/snosd10c.pdf DFN, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3805fg.pdf#page=18), generated with kicad-footprint-generator ipc_plcc_jLead_generator.py PLCC, 44 pins, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x08, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header THT 1x38 1.00mm single row Through hole straight pin header, 2x15, 1.00mm pitch, 2.0mm pin length, single row style2 pin1 right Through hole angled pin header THT 1x39 2.54mm single row style2 pin1 right Through hole socket strip THT 1x03 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x12 1.27mm double row Through hole Samtec HPM power header.

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