Labels Milestones
BackPitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style2 pin1 right Through hole angled pin header THT 1x09 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x06 1.27mm double row Through hole angled socket strip SMD 2x39 2.54mm double row Through hole angled socket strip THT 2x14 2.54mm double row Through hole straight socket strip, 2x35, 2.00mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole pin header SMD 2x26 2.00mm double row Through hole.
- Traces "copper_text_size_h": 1.5, "copper_text_size_v": 1.5.
- -2.805777e-02 -1.366702e-07 vertex -9.019160e+01 9.890142e+01 3.455000e+01 vertex.