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System, 43045-1021 (alternative finishes: 43045-102x), 5 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator connector Molex Micro-Latch top entry Molex Micro-Fit 3.0 Connector System, 53047-0710, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 8-Lead Plastic Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [LFCSP]; (see https://www.intersil.com/content/dam/Intersil/documents/l72_/l72.10x10c.pdf LFCSP VQ, 24 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline http://www.vishay.com/docs/49633/sg2098.pdf SOP, 16 Pin (JEDEC MO-153 Var BF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153.

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