Labels Milestones
BackPanel socket, through-hole, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 10.16mm 400mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 10.16 mm (400 mils THT DIP DIL ZIF 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 7.62 mm (300 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP Switch SPST Slide 7.62mm 300mil 3-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size.
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