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Grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 1x37 1.00mm single row Through hole vertical IDC header THT 1x25 2.00mm single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x14 2.54mm single row.

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