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Package, see http://www.farnell.com/datasheets/5793.pdf Power Integration Y Package SIPAK, Horizontal, RM 1.7mm, Pentawatt, Multiwatt-5, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220-15, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2 Horizontal RM.

• (https://katalog.we-online.de/em/datasheet/9774010482.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board.
• Size 10x9.8mm^2, drill diamater 1.3mm.
• TDFN, 8 Pin (https://ww2.minicircuits.com/case_style/XX211.pdf.

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