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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole IDC header, 2x20, 2.00mm pitch, single row Through hole angled pin header, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header, 2x07, 2.54mm pitch, single row Through hole straight socket strip, 1x21, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x04, 2.54mm pitch, double rows Through hole straight socket strip, 1x29, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x38, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header THT 1x04 2.00mm single row style2 pin1 right Through hole horizontal IDC box header THT 1x35 1.27mm single row Through hole angled pin header, 1x26, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x25, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole Samtec HPM power header series 3.81mm post length, 1x06, 5.08mm pitch, see http://www.vishay.com/docs/88656/kbu4.pdf Vishay KBU rectifier package, 5.08mm pitch, single row Surface mounted socket strip THT 2x07 2.00mm double row surface-mounted straight socket strip, 2x17, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x03 2.54mm double row Through hole.

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