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8.9 mm (350 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 8.61 mm.

• 8.81405 1.79875 3.82299 facet normal.
• -1.326702e-08 -1.000000e+00 -7.842617e-07 facet.
• -9.901917e-001 1.397156e-001 0.000000e+000 vertex -2.013369e+000.
• Bridge Thermal enhanced ultra thin fine pitch quad.
• One side to center of package.

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