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Vias with large copper area, as proposed in http://www.ti.com/lit/ds/symlink/tps5430.pdf TSOP-I, 24 Pin (http://pdfserv.maxim-ic.com/package_dwgs/21-0139.PDF), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0510, with PCB locator, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, SM13B-ZESS-TB (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT109-1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VSON, 8 Pin (https://www.st.com/resource/en/datasheet/l7980.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single.

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