Labels Milestones
BackInductor Inductor, Bourns, SRF1260, 12.5mmx12.5mm (Script generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On Type FFC/FPC Connector, For LVDS, 6.05mm Height, Vertical, Surface Mount, ZIF, Bottom Contact FFC/FPC, 200528-0090, 9 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 5.5, Wuerth electronics 9771080360 (https://katalog.we-online.com/em/datasheet/9771080360.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP44: plastic thin shrink small outline package; 28 leads; body width 5.3 mm; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92S package, drill 0.75mm (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Molded Wide transistor TO-92Mini package, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 11x-dip-switch SPST CTS_Series194-11MSTN, Piano, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD DIP Switch SPST Slide 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads THT DIP DIL ZIF 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL ZIF 15.24mm 600mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size 10.8x19.34mm 7x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62.
- HO 8/15/25-NP Current Transducer (https://www.lem.com/sites/default/files/products_datasheets/la_25-p.pdf LEM current transducer.
- Extra pushbutton panel mounts.
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