Labels Milestones
Back10.0mm solder Pin_ with flat with hole, hole diameter 2.8mm SMD rectangular pad as test Point, diameter 1.0mm test point THT pad THT pad rectangle square SMD pads Net tie, 3 pin, 1.0mm round THT pads Net tie, 4 pin, 0.3mm round THT pads Net tie, 2 pin, 2.0mm square SMD pads Net tie, 2 pin, 1.0mm round THT pads Net tie, 4 pin, 1.0mm round THT pads Net tie, 3 pin, 0.3mm round THT pads Net tie, 4 pin, 2.0mm square SMD rectangular pad as test point, loop diameter 3.8mm, hole diameter 1.0mm THT pad as test Point, diameter 2.0mm, hole diameter 1.3mm, wire diameter 1.0mm wire loop.
- Micro-Fit_3.0 top entry Molex MicroClasp Wire-to-Board System, 55935-0610.
- SOIC-16 With 12 Pin (http://www.ti.com/lit/ds/symlink/ldc1312.pdf#page=62), generated with.
- PSU Add PSU Add PSU Add.