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6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h7a3ai.pdf ST WLCSP-156, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 21x11 Layout, 0.4mm Pitch.

• 0.86608 0.000116599 facet normal 0.920058 0.090613 0.38116.
• -0.633859 -0.0119696 facet normal -0.634832 -0.772567.
• - 4x4x0.5 mm Body [DFN] (see Microchip Packaging.

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