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SMT Top Actuated, http://www.ckswitches.com/media/1476/pts810.pdf Light Touch Switch 0 Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE7.pdf 0 2 2 Button_Switch_SMD SW_SPST_EVQP7A Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE28.pdf 0 4 2 Button_Switch_SMD SW_SPST_EVQP2 Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000CE28.pdf 0 Light Touch Switch, https://industrial.panasonic.com/cdbs/www-data/pdf/ATK0000/ATK0000C374.pdf SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CS325 CSG235 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A Spartan-7 BGA, 15x15 grid, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 256 1 FT256 FTG256 Spartan-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x01, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 1x01 2.54mm single row Surface mounted socket strip SMD 1x15 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x20 2.54mm single row Through hole socket strip THT 1x40 1.00mm single row Through hole pin header THT 1x16 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x40 1.27mm double row surface-mounted straight socket strip, 1x30, 1.00mm pitch, 2.0mm pin length, double rows Through hole straight socket strip, 1x39, 2.00mm pitch, 4.2mm pin length, double rows Through hole IDC box header THT 1x33 1.00mm single row style2 pin1 right Through hole angled pin header, 2x20, 1.27mm pitch, 4.0mm pin length, double rows Through hole Samtec HPM power header series 3.81mm post length THT 1x08 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x25 2.54mm single row Through hole IDC header, 2x20, 2.00mm pitch, single row Through hole socket strip SMD 1x22 2.54mm single row style2 pin1 right Through hole pin header SMD 1x18 2.00mm.

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