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Attr exclude_from_pos_files exclude_from_bom) Final revision; added custom DRC as project file new_footprints Added hard sync to schematic, laid out PCB with 2 copper strip SMD 1x16 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x33 1.00mm double row Through hole Samtec HPM power header series 3.81mm post length, 1x10, 5.08mm pitch, single row style2 pin1 right Through hole straight socket strip, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 1x27 1.27mm single row (from Kicad 4.0.7!), script generated Through hole angled socket strip, 2x37, 2.00mm pitch, double rows Through hole vertical IDC header THT 2x11 2.54mm double row surface-mounted straight pin header, 2x05, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole horizontal IDC box header 2x20 2.54mm double row Through hole pin header THT 1x04 2.54mm single row Through hole pin header THT 2x03 2.54mm double row surface-mounted straight pin header, 1x17, 1.00mm pitch, 2.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x06 2.00mm double row Through hole angled socket strip SMD 1x35 2.00mm single row style2 pin1 right Through hole straight pin header, 2x28, 2.00mm pitch, single row Through hole angled socket strip SMD 1x04 1.00mm single row Through hole straight pin header, 1x35, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments LM25119 http://www.ti.com/lit/ds/symlink/lm25119.pdf WQFN, 42 Pin https://content.u-blox.com/sites/default/files/NINA-B1_DataSheet_UBX-15019243.pdf#page=30 NINA ublox u-blox b111 bluetooth nrf52840 module Omron Relay, DPST, https://omronfs.omron.com/en_US/ecb/products/pdf/en-g2rl.pdf Relay, SPDT Form C, Gull Wings, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Data+Sheet%7F108-98001%7FZ.1%7Fpdf%7FEnglish%7FENG_DS_108-98001_Z.1.pdf TE IM-Series Relay SPDT.

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