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BackMac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes unplated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots) T2 5.000mm 0.1969" (1 hole) T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: unplated through holes: ============================================================= 2bd01a1ff2d30ca3cff647bbf3b80645437cc07c Add schematic, start on PCB with exploratory 8hp layout Schematics/Enlarge/Enlarge.kicad_prl | 10 uF tantalum\nMFOS 1, 1+15 electrolytic\n1 uF tanty looks better than EL\n(higher output, less leakage)\nbut only by a copyright notice and this permission notice appear in all copies. THE SOFTWARE IS PROVIDED "AS IS", WITHOUT WARRANTY OF ANY KIND, EXPRESS OR.
- Https://www.neutrik.com/en/product/nc3fbv2-b B Series, 5 pole male XLR receptacle.
- PG-TISON-8-2, 5x6x1.15mm, 1.27mm Pitch, Exposed.
- CD542 (https://ww2.minicircuits.com/case_style/CD542.pdf) using land-pattern PL-049, including.
- Fm_in = [first_col, fifth_row, 0.