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MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 24.13 mm (950 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 7x-dip-switch SPST , Piano, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 2.54mm TO-220-4, Horizontal, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Vertical RM 10.9mm TO-264-3, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 2.54mm TO-247-5, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220F-5, Vertical, RM 1.27mm, staggered type-2 TO-220-7 Horizontal RM 1.27mm staggered type-1 TO-220F-5, Vertical, RM 1.7mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 0.9mm staggered type-2 TO-220F-4, Vertical, RM 1.27mm, staggered type-1 TO-220-11, Vertical, RM 2.286mm SIPAK Vertical RM 2.54mm TO-247-4, Vertical, RM 1.7mm, MultiwattF-11, staggered type-2, see http://www.st.com/resource/en/datasheet/l298.pdf TO-220-15 Horizontal RM 2.54mm TO-220F-4, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-7 Horizontal RM 1.7mm PentawattF- MultiwattF-5.

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