Labels Milestones
Back2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 1.7mm Pentawatt Multiwatt-5 TO-220-5, Vertical, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 2.29mm IPAK TO-262-3, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-11, Vertical, RM 2.286mm SIPAK Vertical RM 2.54mm TO-220F-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-7 Vertical RM 5.08mm TO-220F-2, Vertical, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-5, Vertical, RM 2.54mm, staggered type-1 TO-220-8 (Multiwatt8), Vertical, 2.54mm Pitch Multiwatt 8 TO-220-9, Vertical, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220F-4, Vertical, RM 0.97mm, Multiwatt-9, staggered type-2 TO-220-11, Vertical, RM 0.9mm, staggered type-2 TO-220F-11, Vertical, RM 3.81mm, see https://www.onsemi.com/pub/Collateral/NJL3281D-D.PDF TO-264-5 Vertical RM 1.7mm staggered type-1 TO-220-11, Vertical, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Vertical RM 5.45mm TO-264-5, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 7.62mm 300mil PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL ZIF 10.16mm 400mil SMDSocket SmallPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf DIP Switch SPST Slide 5.25mm 206mil JPin SMD 2x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 10.16mm 400mil LongPads 5-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 11x-dip-switch SPST , Slide, row spacing 24.13 mm (950 mils), SMDSocket, LongPads 10-lead.
- Ipc_noLead_generator.py EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00487-01.pdf.
- S4B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator.
- . <- all surdos BSD: .