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SO, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 4x4mm body, pitch 0.5mm, thermal.

Ref="R11" Part="1" AR Path="/607ED812/609384DB" Ref="#FLG03" Part="1" AR.
0 -0.110432 -0.993884 vertex -1.31069 3.16429 16.275 vertex.
Normal -0.0948182 -0.029279 0.995064 facet normal 0.48503 -0.124395.

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