Labels Milestones
BackWafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, off-center.
- BB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py.
- Connector, BM04B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with.