3
1
Back

Plasic small outline package; 56 leads (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot369-1_po.pdf SSOP, 16 Pin (http://www.thatcorp.com/datashts/THAT_1580_Datasheet.pdf), generated with kicad-footprint-generator Hirose DF63 through hole, DF11-24DP-2DSA, 12 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with.

New Pull Request