3
1
Back

SO-8FL CASE 488A ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 24 leads; body width 16.90 mm Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 DIL DIP PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET M2 MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MD MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET SC MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET MC MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET ME MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET M2 MOSFET Infineon.

New Pull Request