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18.8x8mm body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 32 reverse TSOP-I, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430g2755.pdf#page=70 JEDEC MO-220 variation VJJD-2), generated with kicad-footprint-generator connector JST PUD series connector, SM10B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.5 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 3.5mm, size 7x7.6mm^2, drill diamater 1.1mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block TE 282834-6 pitch 2.54mm size 15.7x6.2mm^2 drill 1.1mm pad 2.1mm terminal block Metz Connect Type055_RT01502HDWU, 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 1.6mm, 2 pins, diameter 5.0mm, 4 pins, pitch 10mm, size 122x14mm^2, drill diamater 1.2mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00287_DB_EN.pdf, script-generated using.

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