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ON-ON horizontal MEC 5G single pole normally-open illuminated tactile switch SPST right angle, http://www.ckswitches.com/media/1428/os.pdf 1x-dip-switch SPST , Slide, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 9.53 mm (375 mils 16-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 11.48mm 451mil 6-lead surface-mounted (SMD) DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 2x-dip-switch SPST Copal_CHS-02B, Slide, row spacing 7.62 mm (300 mils), body size 6.7x29.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x29.5mm 11x-dip-switch SPST , Piano, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 7x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 9.78x30.12mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads THT DIP DIL ZIF 10.16mm 400mil Socket 3M 14-pin zero insertion force socket, through-hole, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 18-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x14.26mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DFN, 6 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant BA), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-119-02-xx-DV-PE-LC, 19 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 0.75 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with feed.

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