3
1
Back

FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row style2 pin1 right Through hole angled pin header, 2x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x13, 2.00mm pitch, 4.2mm pin length, single row Surface mounted pin header SMD 2x19 1.27mm double row Through hole straight socket strip, 1x01, 2.54mm pitch, 6mm pin length, single row Through hole angled socket strip, 1x18, 2.00mm pitch, 4.2mm pin length, double rows Through hole socket strip THT 2x32 1.00mm double row surface-mounted straight socket strip, 1x38, 1.00mm pitch, single row Through hole straight socket strip, 1x36, 2.00mm pitch, single row Through hole straight pin header, 1x13, 2.54mm pitch, 6mm pin length, double rows Through hole straight socket strip, 1x24, 2.00mm pitch, double cols.

New Pull Request