Labels Milestones
Back3.9x4.9mm body, exposed pad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON 0.5 thermal vias 10-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body [QFN] (see datasheet at http://www.cypress.com/file/138911/download and app note at http://www.cypress.com/file/140006/download DFN, 6 Pin (https://www.jedec.org/sites/default/files/docs/Mo-178c.PDF variant AA), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53048-0310, 3 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Molex LY 20.
- Package; 2 terminals; 0.4 mm pitch; 0.6 mm.
- Href="https://gitea.circuitlocution.com/ /arrasta/commit/744b72ef7e0d94fccfae99ec3cb3514981ac4616">744b72ef7e0d94fccfae99ec3cb3514981ac4616 c9e81f0cc630cea052574ce7c50b3e82145bb626