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Package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf TSSOP, 8 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0168.PDF), generated with kicad-footprint-generator JST ZE series connector, S08B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package; 44 leads; body width 4.4 mm; Exposed Pad (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20.

-9.68157 2.4858 0.0440141 vertex -9.58858 2.77357 0.0391082 facet.
3.005 12.85 vertex -0.4.
1 6.92771 7.89317 vertex 1 6.92882.
9.807886e-01 -0.000000e+00 facet normal 0.262695 0.257305.

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