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Pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 14-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad TSSOP HTSSOP 0.65 thermal pad HTSSOP32: plastic thin shrink small outline package; 44 leads; body width 7.5 mm; (see NXP.

Single and Dual Output.
-5.036913e+000 2.496000e+001 vertex -5.566618e+000 8.944240e-001.

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