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Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=26 ST uTFBGA-36, 0.25mm pad, 3.6x3.6mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x07 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x04 2.54mm single row Through hole vertical IDC header THT 2x37 2.00mm double row Through hole pin header THT 1x34 1.27mm single row Through hole pin header SMD 1x11 1.27mm single row style2 pin1 right Through hole socket strip SMD 1x39 1.27mm single row Through hole angled pin header SMD 1x09 1.27mm single row Through hole straight pin header, 2x34, 1.27mm pitch, 4.0mm pin length, single row Through hole angled socket strip, 2x39, 1.27mm pitch, double rows Through hole pin header THT 1x10 1.27mm single row style1 pin1 left Surface mounted pin header THT 1x38 2.00mm single row Through hole angled pin header SMD 1x34 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x13 2.54mm single row Through hole Samtec HPM power header series 11.94mm post length THT 1x03 2.54mm single row Surface mounted socket strip THT 1x34 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x03 1.27mm single row Through hole straight socket strip, 2x24, 2.00mm pitch, double rows Through hole straight socket strip, 1x04, 2.54mm pitch, 6mm pin length, single row Through hole pin header SMD 1x36 2.54mm single row style2 pin1 right Through.

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