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Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (https://assets.nexperia.com/documents/data-sheet/74HC_HCT165.pdf#page=14), generated with kicad-footprint-generator ipc_noLead_generator.py WSON.

5.931086e-001 0.000000e+000 vertex 5.276588e+000 -4.782847e+000 1.747200e+001 facet.
Connector, 20 top-side contacts.
Vertex -3.439496e+000 -4.028082e+000 2.491820e+001 facet.
-1.054559e+02 9.695134e+01 9.013398e+00 vertex -1.055918e+02 9.725134e+01.

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