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= [second_col, second_row, 0]; //Third row interface placement f_tune = [width_mm/2 - h_margin, top_row, 0]; f_tune = [second_col, second_row, 0]; //Third row interface placement pwm_in = [input_column + h_margin/2, row_1, 0]; left_rib_x = thickness * 1.2; right_rib_x = width_mm - col_right - thickness; left_panel_width = 12.5*3 + tolerance*4 + 2; // plastic walls are 2mm 3D Printing/Pot_Knobs/knob_docs.scad Executable file View File Mon 10 May 2021 12:33:34 AM EDT Generated from schematic into main afea9d5a2c Final revision; added custom DRC as project file tstamp eb945be1-4d1d-46b5-b945-d4ebde74dae2) Final revision; added custom DRC as project file ) ) ) ) Latest commits for file Panels/title_test_18.stl 0 0 0 0 Y N 1 F N DEF 2_pin_Molex_header J 0 40 Y N 1 F N DEF SW_SPST_LED SW 0 0 Y N 2 F N DEF SW_Coded_SH-7040 SW 0 40 Y N 1 F N DEF SW_Reed_SPDT SW 0 20 Y Y 1 F N DEF SW_Push_Dual SW 0 40 Y N 1 F N DEF Graphic GRAF 0 40 Y Y 1 F N DEF SW_MEC_5G_2LED SW 0 0 Y N 2 N In normal position, loop is disconnected from trigger,\nnormalization is removed from gate jack, and\nsustain pot level is used. In loop position, loop\nis connected to trigger, gate jack is normalized\nto +12 V, and sustain voltage is taken from \npot pin 1 x 1 mm, 734-168 , 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0210, with PCB locator, 13 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 2.5 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 2mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.25 mm² wires, basic insulation, conductor diameter 0.4mm, outer diameter 1.7mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 3.5mm, size 14.7x7mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 236-407 45Degree pitch 7.5mm size 119x15mm^2 drill 1.2mm pad 3mm Terminal Block WAGO 236-608 45Degree pitch 5mm size 30x9mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type701_RT11L03HGLU, 3 pins, pitch 5mm, size 30x9.8mm^2, drill diamater 1.2mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Pico-EZmate_Slim series connector, B10B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A ON Semiconductor.

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