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8.4mm m8 Mounting Hardware, inside through hole 2.7mm, height 6.5, Wuerth electronics 9776025960 (https://katalog.we-online.com/em/datasheet/9776025960.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DD Package; 12-Lead Plastic Micro Small Outline (SO) - Wide, 7.50 mm Body [SOIC] (https://docs.broadcom.com/docs/AV02-0169EN SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL ZIF 7.62mm 300mil 1x-dip-switch SPST Copal_CHS-01A, Slide, row spacing 15.24 mm (600 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 6x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), body size 10.8x9.18mm 3x-dip-switch SPST KingTek_DSHP03TS, Slide, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic Micro Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC 2.54 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [TQFP] (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf MLF, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0108.PDF U20E-1), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Double Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89016xx, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 53047-1210, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Very Thin Dual Flatpack No-Lead (LZ) - 2x3x0.9 mm Body (see Atmel Appnote 8826 10-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 10-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket THT DIP DIL ZIF 25.4mm 1000mil Socket LongPads 64-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 5.9 mm (232 mils), body size 9.78x25.04mm (see e.g.

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