Labels Milestones
BackPanel socket, through-hole, row spacing 15.24 mm (600 mils 42-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST .
- Requested
- (http://www.ti.com/lit/ds/symlink/ts3l501e.pdf#page=23), generated with kicad-footprint-generator Tantalum.
- 0.0827209 0.993289 vertex -4.3279 -5.83299 7.92316.
- Pin pitch=19.60mm, , diameter=21.8mm.