Labels Milestones
BackTSSOP10: plastic thin shrink small outline package; 18 leads; body width 4.4 mm; Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0140.PDF (T3255-6)), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board.
- Printing/Panels/image.png' 3D Printing/Panels/image.png | Bin.
- Secondary License. 1.6. "Executable Form.