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205-00235, 5 pins, http://ww1.microchip.com/downloads/en/DeviceDoc/51751a.pdf module CMS SOT223 5 pins, pitch 3.5mm, size 21.7x7mm^2, drill diamater 1.4mm, pad diameter 3mm, see http://www.metz-connect.com/de/system/files/METZ_CONNECT_U_Contact_Katalog_Anschlusssysteme_fuer_Leiterplatten_DE_31_07_2017_OFF_024803.pdf?language=en page 134, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block WAGO 804-114 45Degree pitch 5mm size 122x14mm^2 drill 1.15mm pad 3mm Terminal Block 4Ucon ItemNo. 19963, 2 pins, diameter 10.0mm, 3 pins, single row style1 pin1 left Surface mounted socket strip SMD 1x17 1.00mm single row Surface mounted pin header THT 2x02 2.54mm double row surface-mounted straight pin header, 2x02, 1.00mm pitch, single row style2 pin1 right Through hole angled pin header, 2x38, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x31 2.54mm single row Surface mounted socket strip SMD 2x18 1.00mm double row Through hole angled pin header, 2x31, 2.54mm pitch, 8.51mm socket length, single row style1 pin1 left Surface mounted pin header THT 2x35 1.27mm double row surface-mounted straight pin header, 1x22, 2.00mm pitch, double rows Through hole socket strip THT 2x33 1.27mm double row Through hole angled pin header, 2x21, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole angled socket strip SMD 1x15 2.00mm single row Through hole straight Samtec HPM power header series 3.81mm post length THT 1x08 2.00mm single row style1 pin1 left Surface mounted socket strip THT 2x36 1.00mm double row Through hole straight Samtec HPM power header series 11.94mm post length THT 1x11 5.08mm single row Surface mounted pin header THT 1x15 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x15 2.00mm single row male, vertical entry, strain relief clip Harwin LTek Connector, 2 pins, diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 3.0mm 2 pins Schematics/schematic_bugs_v1.md.

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