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HLE-136-02-xx-DV-TE, 36 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3591, 35 Circuits (http://www.molex.com/pdm_docs/sd/5022503591_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, SM07B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On Type FFC/FPC Connector, For LVDS, 6.05mm Height, Vertical, Surface Mount, ZIF, 33 Circuits (https://www.molex.com/pdm_docs/sd/5022313300_sd.pdf Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact Style, 24 Circuits (http://www.molex.com/pdm_docs/sd/5022441530_sd.pdf Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact Style, 33 Circuits (https://www.molex.com/pdm_docs/sd/5022313300_sd.pdf Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0040, 4 Circuits (https://www.molex.com/pdm_docs/sd/2005280040_sd.pdf), generated with kicad-footprint-generator JST XH series connector, B6PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 14 Pin (https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf#page=28), generated with kicad-footprint-generator ipc_noLead_generator.py DFN 8 2x2mm, 0.5mm http://www.qorvo.com/products/d/da000896 DFN 0.5 ST 20-Lead Plastic Thin Quad Flatpack No-Lead Package, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 4x3 grid, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=304, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, YFF0006, NSMD.

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