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Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments EUS 5 Pin (https://www.jedec.org/sites/default/files/docs/MO-193D.pdf variant AB), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 36 Pin (https://www.trinamic.com/fileadmin/assets/Products/ICs_Documents/TMC2100_datasheet_Rev1.08.pdf#page=43), generated with kicad-footprint-generator.

• 0.886446 facet normal 7.768649e-01.
• Sq thermal pad 3x2mm Pitch 0.5mm right angle.
• Make power connection traces.
• -9.92115 1.25333 0 vertex -3.44415 8.31492 3.82299 facet.
• 3.333752e-001 5.830798e-001 7.408636e-001 vertex 4.724722e-002.

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