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For: MC_1,5/7-G-3.81; number of pins: 04; pin pitch: 7.50mm; Vertical || order number: 1847615 8A 320V Generic Phoenix Contact connector footprint for: MCV_1,5/15-G-3.81; number of pins: 06; pin pitch: 3.81mm; Vertical || order number: 1924376 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/5-G-3.5; number of pins: 12; pin pitch: 3.50mm; Vertical || order number: 1843266 8A 160V Generic Phoenix Contact connector footprint for: GMSTB_2,5/3-GF-7,62; number of pins: 16; pin pitch: 7.62mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C or ISO 7049-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1755817 12A || order number: 1755820 12A || order number: 1803426 8A 160V Generic Phoenix Contact SPT 2.5/1-H-5.0 Terminal Block, 1732535 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732535), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 2 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (https://www.akm.com/akm/en/file/datasheet/AK5394AVS.pdf#page=23), generated with kicad-footprint-generator ipc_gullwing_generator.py 64-Lead Plastic Thin Quad Flatpack No-Lead Package, 9x9mm Body (see Atmel Appnote 8826 10-Lead Plastic WSON, 4x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled pin header, 1x01, 2.54mm pitch, double rows Through hole socket strip THT 2x23 2.54mm double row Through hole straight socket strip, 1x10, 2.00mm pitch, double rows Surface mounted pin header SMD 1x26 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x17 2.00mm single row Through hole angled socket strip SMD 1x31 1.27mm single row Through hole angled socket strip, 1x04, 1.00mm pitch, double rows Through hole straight socket strip, 1x26, 2.00mm pitch, 6.35mm socket length, single.

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