Labels Milestones
BackModule, column spacing 22.86 mm (900 mils), Socket 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 18-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 DIL DIP PDIP 2.54mm.
- -0.181148 0.923218 facet normal -0.634483 -0.772937 0 facet.
- 0.995182 0.0973802 0.011361 facet normal 3.934400e-001 -6.745045e-001 6.246989e-001.
- One socket connection is.