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Module, column spacing 22.86 mm (900 mils), Socket 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 18-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils Toshiba 11-7A9 DIL DIP PDIP 2.54mm.

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