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Definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x30 2.00mm double row Through hole angled pin header, 1x24, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x02, 1.00mm pitch, single row style1 pin1.

And (b describe the limitations.
TR TO-3 TO3 TO-204 TO-3P-3, Horizontal, RM.

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