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PowerDI3333-8, Plastic Dual Flat, No Lead Package (MR) - 9x9x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad 3x2mm Pitch 0.5mm Analog Devices KS-4.

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