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22.5mmx21.5mm https://www.schaffner.com/products/download/product/datasheet/rn-series-common-mode-chokes-new/ Current-compensated Chokes, Schaffner, RN112-04, 17.7mmx17.1mm https://www.schaffner.com/products/download/product/datasheet/rn-series-common-mode-chokes-new/ Current-compensated Chokes, Schaffner, RN112-04, 17.7mmx17.1mm https://www.schaffner.com/fileadmin/user_upload/pim/products/datasheets/RN_series.pdf common mode, inductor, filter, https://productfinder.pulseelectronics.com/api/open/product-attachments/datasheet/ph9455.105nl Shielded High Current Power Inductors 23.5x22mm, https://productfinder.pulseelectronics.com/api/open/product-attachments/datasheet/pa4349.104anlt Shielded Molded High Current Inductors (https://www.vishay.com/docs/34295/sc15ah01.pdf SMD Vishay Inductor Low Profile DFS "Flat", see http://www.vishay.com/docs/88874/dfl15005.pdf SMD diode bridge Three phase, Bridge, Rectifier 4-lead round diode bridge Thermal enhanced ultra thin SMD package; 3 leads; body: 4.3x6.1x0.43mm, https://www.vishay.com/docs/95570/to-277asmpc.pdf 3-pin TSOT23 package, http://www.analog.com.tw/pdf/All_In_One.pdf TSOT, 5 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=269, NSMD pad definition Appendix A BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA-6, 0.704x1.054mm, NSMD, YKA pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header SMD 1x30 2.00mm single row Surface mounted socket strip SMD 1x33 2.54mm single row Through hole pin header THT 2x14 1.27mm double row Through hole angled pin header, 2x05, 2.54mm pitch, 6mm pin length, single row style1 pin1 left.

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