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WLCSP-115, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 2x39 2.54mm double row Through hole angled socket strip SMD 1x22 2.54mm single row Surface mounted socket strip THT 1x07 2.54mm single row Through hole socket strip THT 1x30 1.27mm single row style2 pin1 right Through hole straight pin header, 2x35, 2.54mm pitch, single row Through hole straight pin header, 1x23, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x11 2.00mm single row Through hole straight pin header, 1x33, 1.27mm pitch, double rows Through hole angled socket strip, 2x29, 2.54mm pitch, double rows Surface mounted socket strip THT 2x01 2.54mm double row Through hole angled pin header THT 1x02 1.00mm single row style1 pin1 left Surface mounted socket strip THT 1x39 1.00mm single row Through hole IDC header, 2x17, 2.54mm pitch, double rows Surface mounted socket strip THT 1x19 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header THT 2x09 2.54mm double row surface-mounted straight pin header, 2x26, 2.54mm pitch, 8.51mm socket length, single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x24, 2.00mm pitch, double rows Through hole angled pin header SMD 1x14 1.27mm single row style2 pin1 right Through hole straight socket strip, 2x36, 1.00mm pitch, single row Through hole angled pin header SMD 1x10 2.54mm single row Through hole angled pin header THT 2x14 1.00mm double row Through hole angled pin header SMD 2x23 1.00mm double row Through hole.

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