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(300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 28-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 9.78x30.12mm (see e.g.

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