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System, 43045-2421 (alternative finishes: 43045-120x), 6 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 6-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 11x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size (see https://www.omron.com/ecb/products/pdf/en-a6h.pdf SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 7x-dip-switch SPST CTS_Series194-7MSTN, Piano, row spacing 7.62 mm (300 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=78, NSMD pad definition (http://www.ti.com/lit/ds/symlink/tlv320aic23b.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm.

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